2026 International Conference on Integrated Circuits and Mechanical Manufacturing

About to ICICMM 2026

The International Conference on Integrated Circuits and Mechanical Manufacturing (ICICMM 2026) will be held grandly in Shanghai, the economic center and innovation hub of eastern China. As a forefront of China's high-tech industry, especially in the development of electronic information technology, Shanghai provides an excellent communication background for this conference with its profound industrial heritage and surging technological vitality. The purpose of this conference is to gather top scholars, engineers, and industry experts in the fields of integrated circuits and mechanical manufacturing from around the world to explore cutting-edge breakthroughs and collaborative development in these two areas. The conference will focus on core topics such as integrated circuit design and manufacturing, very large scale integration (VLSI), system on chip (SoC), and low-power design technologies; At the same time, in the mechanical manufacturing sector, we will focus on the latest developments in intelligent design optimization, advanced numerical control technology, microelectronic packaging equipment, and green manufacturing processes. The specially designed industry university research docking and young scientist forum aims to promote in-depth dialogue between academic newcomers and senior experts, accelerate the transformation of scientific research achievements into practical productivity. ICICMM 2026 is committed to creating a high-level international academic exchange platform. We sincerely invite colleagues from around the world to gather in Shanghai, a city with both historical heritage and future vision, to join hands and promote the cross-border integration of integrated circuits and mechanical manufacturing, contributing wisdom and strength to global technological progress and industrial upgrading.